HANAU — In a groundbreaking development poised to revolutionize data centers and AI hardware, a pioneering optical packaging technology has been unveiled, jointly developed by the Chair of Integrated Photonics at RWTH Aachen University and aiXscale Photonics. This cutting-edge technology promises to usher in a new era of computing solutions, offering smaller footprints, significantly reduced energy consumption, and vastly improved data transfer rates, according to a press release published on EuropaWire .

The innovative packaging technology, in conjunction with Photonic Integrated Circuits (PICs), has attracted significant support from Heraeus, a global leader in advanced materials technology for the semiconductor industry. Steffen Metzger, a member of the Group Management Committee at Heraeus, emphasized the strategic importance of the collaboration, stating, “Heraeus’ strength is to provide investment, infrastructure, and strategic support to accelerate aiXscale’s growth.”

Prof. Dr. Jeremy Witzens and Dr. Florian Merget, founders of aiXscale Photonics GmbH, expressed their enthusiasm for the partnership with Heraeus, citing the latter’s deep expertise in material sciences and long-term strategic vision. The exact investment volume remains undisclosed, but both parties are committed to driving innovation in the semiconductor sector.

Darrell Childers, Vice-President of Research and Development at US Conec, lauded the initiative, emphasizing the importance of end-to-end fiber connectivity and the creation of a complete ecosystem for co-packaged optics.

Optical data transmission, increasingly replacing copper cables in data centers and AI hardware, is hailed as essential for transmitting vast amounts of data in an energy-efficient manner. Highly integrated PICs play a crucial role in bridging the gap between optical fibers and computers, but the physical connection of the optical fiber to the PIC poses significant challenges. aiXscale Photonics’ novel optical packaging technology addresses these challenges by enabling wafer-level packaging of chip-scale optical and electrical systems.

Heraeus and aiXscale Photonics anticipate PICs to outperform conventional optical technologies and effectively compete with non-optical solutions. The ability to manufacture optical systems at the silicon wafer level using aiXscale Photonics technology, combined with conventional manufacturing steps for fiber optic connectivity, promises to make optical technologies more affordable.

François Lelarge, CTO at Almae Technologies, commended the European startup for its pioneering efforts in automated optical packaging, emphasizing its potential to drive down manufacturing costs and propel technological advancement.

The unveiling of this innovative optical packaging technology marks a significant milestone in the quest for more efficient and cost-effective computing solutions, with profound implications for industries reliant on data centers and AI hardware.